| Summary: | 碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 103 === The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the plating liquid to achieve such better result.
This paper described first depositing palladium film on FR-4 substrate by chemical plating, and addition of Polyethyleneimine on electroplating copper at the plating solution during electroplating.
The images of Scanning Electron Microscope (SEM) of samples fabricated with plating solution as taken by using different magnification (x800、x3000、x 9000), that show 0.5 ppm of PEI have the best flatness. However, 0.5 ppm of PEI has fastest deposition rate. The resistance and resistivity measured by Four Point Sheet Resistance Meter probes. 0.5 ppm of PEI has the lowest resistivity (0.138μΩ-cm) and sheet resistance (0.477Ω). Results of X-ray diffraction show that crystalline phase of deposited metal are (200) phase.
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