Effects of Polyethyleneimine on Electroplating Copper

碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 103 === The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the pla...

Full description

Bibliographic Details
Main Authors: Ping-Yu Hsieh, 謝秉諭
Other Authors: Shyh-Min Liang
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/16563401198112987201
id ndltd-TW-103MHIT0063016
record_format oai_dc
spelling ndltd-TW-103MHIT00630162016-08-28T04:12:00Z http://ndltd.ncl.edu.tw/handle/16563401198112987201 Effects of Polyethyleneimine on Electroplating Copper 探討電鍍液中添加聚乙烯亞胺對鍍層之影響 Ping-Yu Hsieh 謝秉諭 碩士 明新科技大學 化學工程與材料科技系碩士班 103 The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the plating liquid to achieve such better result. This paper described first depositing palladium film on FR-4 substrate by chemical plating, and addition of Polyethyleneimine on electroplating copper at the plating solution during electroplating. The images of Scanning Electron Microscope (SEM) of samples fabricated with plating solution as taken by using different magnification (x800、x3000、x 9000), that show 0.5 ppm of PEI have the best flatness. However, 0.5 ppm of PEI has fastest deposition rate. The resistance and resistivity measured by Four Point Sheet Resistance Meter probes. 0.5 ppm of PEI has the lowest resistivity (0.138μΩ-cm) and sheet resistance (0.477Ω). Results of X-ray diffraction show that crystalline phase of deposited metal are (200) phase. Shyh-Min Liang 梁世明 2015 學位論文 ; thesis 64 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 103 === The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the plating liquid to achieve such better result. This paper described first depositing palladium film on FR-4 substrate by chemical plating, and addition of Polyethyleneimine on electroplating copper at the plating solution during electroplating. The images of Scanning Electron Microscope (SEM) of samples fabricated with plating solution as taken by using different magnification (x800、x3000、x 9000), that show 0.5 ppm of PEI have the best flatness. However, 0.5 ppm of PEI has fastest deposition rate. The resistance and resistivity measured by Four Point Sheet Resistance Meter probes. 0.5 ppm of PEI has the lowest resistivity (0.138μΩ-cm) and sheet resistance (0.477Ω). Results of X-ray diffraction show that crystalline phase of deposited metal are (200) phase.
author2 Shyh-Min Liang
author_facet Shyh-Min Liang
Ping-Yu Hsieh
謝秉諭
author Ping-Yu Hsieh
謝秉諭
spellingShingle Ping-Yu Hsieh
謝秉諭
Effects of Polyethyleneimine on Electroplating Copper
author_sort Ping-Yu Hsieh
title Effects of Polyethyleneimine on Electroplating Copper
title_short Effects of Polyethyleneimine on Electroplating Copper
title_full Effects of Polyethyleneimine on Electroplating Copper
title_fullStr Effects of Polyethyleneimine on Electroplating Copper
title_full_unstemmed Effects of Polyethyleneimine on Electroplating Copper
title_sort effects of polyethyleneimine on electroplating copper
publishDate 2015
url http://ndltd.ncl.edu.tw/handle/16563401198112987201
work_keys_str_mv AT pingyuhsieh effectsofpolyethyleneimineonelectroplatingcopper
AT xièbǐngyù effectsofpolyethyleneimineonelectroplatingcopper
AT pingyuhsieh tàntǎodiàndùyèzhōngtiānjiājùyǐxīyàànduìdùcéngzhīyǐngxiǎng
AT xièbǐngyù tàntǎodiàndùyèzhōngtiānjiājùyǐxīyàànduìdùcéngzhīyǐngxiǎng
_version_ 1718380562807259136