Effects of Polyethyleneimine on Electroplating Copper
碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 103 === The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the pla...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16563401198112987201 |