Analysis of Microtip Arrays Mold for Hot Embossing on Glass

• Main Authors: Su, Yi-Hsiang, 蘇逸翔
• Other Authors: Hung, Ching-Hua
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/87394331873471357485

碩士 === 國立交通大學 === 機械工程系所 === 103 === In this research, a glass Spindt-type field emission source was designed by using the hot embossing technology to manufacture glass microtip array which was then coated with a layer of conductive film. In this process, making the microstructure mold is very difficult and important. The challenge includes the small structure size, the huge numbers of structure, the high requirements of accuracy and the high temperature or pressure the mold has on hot embossing process. This research has successfully developed the process of manufacturing microstructure mold. By the method of dicing, the study produce raised microstructure on WC then printing the microstructure on SUS304 mold by pressure. And it has been proved that the SUS304 mold can be used to manufacture the glass microtip array by hot embossing.