ElectromigrationStudy on Cu/Al/Ti/Si Schottky Diodes
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 103 === In this research, we studied the electromigration effect on commercial Cu/Al/Ti/Si schoottky diodes. The structure of Schottky diode consisted of copper wire bonds, aluminum metal pads, Titanium barrier layers and N type silicon substrates. The reaction...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75201319377100849614 |