Electrical Characteristics of System in a Package
博士 === 國立彰化師範大學 === 機電工程學系所 === 103 === This study proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced high speed systems. The characteristics of high frequency, signal integrity (SI...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/92144529119551798626 |