APA (7th ed.) Citation

Wang, M., 王銘漢, & Wu, M. (2014). Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.

Chicago Style (17th ed.) Citation

Wang, Ming-Han, 王銘漢, and Mei-Ling Wu. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure Under Thermal and Moisture Effects. 2014.

MLA (8th ed.) Citation

Wang, Ming-Han, et al. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure Under Thermal and Moisture Effects. 2014.