Joining of Alumina to Aluminum and Its Interfacial Properties

• Main Authors: Chun-Yu Lin, 林君郁
• Other Authors: Wei-Hsing Tuan
• Format: Others
• Language: en_US
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/18061709239183575970

碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 103 === Direct bonded aluminum (DBA) substrates can serve as carriers for power electronic components. However, the aluminum is easily oxidized. The oxide layer formed on the metallic aluminum surface prevents the formation of a strong bonding between aluminum and ceramic. The aim of the present study provides a detailed characterization on the processing and interfacial characterization of Al/Al2O3 joints. The bonding process was held above the melting temperature of Al, so the Al could be bonded to Al2O3 at its liquid state. The microstructure observation and phase analysis were carried out on the interface between Al and Al2O3. The interfacial strength of Al/Al2O3 interfaces and the flexural strength of Al2O3/Al/Al2O3 joints were determined by a four-point bending test. The thermal conductivities of the bilayer and trilayer bonding specimens was measured by flash method. After bonding at elevated temperatures, many pores were observed at the interface. The presence of pores seriously damaged the properties of bonding specimens. The relationships between interfacial properties and mechanical properties or thermal conductivity are established and the mechanism for pore formation is proposed.