Joining of Alumina to Aluminum and Its Interfacial Properties
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 103 === Direct bonded aluminum (DBA) substrates can serve as carriers for power electronic components. However, the aluminum is easily oxidized. The oxide layer formed on the metallic aluminum surface prevents the formation of a strong bonding between aluminum and...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/18061709239183575970 |