A Research of Process Trends of Electronica's Carrier Tape

• Main Authors: Ming-hung Hsu, 徐銘鴻
• Other Authors: Yung-Hsiang Tu
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/31300301045545695074

碩士 === 大同大學 === 工業設計學系(所) === 103 === ABSTRACT The main purpose of this study to understand the electronic components of Carrier Tape bearing belt industry, in the face of various electronic components and components when, how to design and select the proper packaging of electronic components carrier tape manufacturing process, in order to improve the carrier tape in the production process stability, and reduce costs, reach to meet customer demand for products, and look forward to providing the industry's various electronic components to Carrier Tape Manufacturer reference. This study analyzed 10 clusters in class representative electronic components derived Carrier Tape’s samples, and with the main ingredient Image Space Imagery Vocabulary 12 groups were established to explore space spread, the first principal component derived stabilizing factor for the "precise - not accurate "and the second main component yield factor is" high cost - low-cost "two images constituted intervals. And with the process capability index analysis, that the electronic components of Carrier Tape is a clear distinction between user and feel the results of the electronic components of Carrier Tape differences embodied process, and in the packaging of electronic components bearing zone design stage, namely public molding process for the design direction, more in line with the right to expect the user carrying the product. Keywords: SMT, Carrier tape, Package, Mold design