| Summary: | 碩士 === 元智大學 === 工業工程與管理學系 === 103 === Production process of Printed circuit boards PCBs contains repeated lamination, making blind hole through laser drilling, and using the line, made by electroplating and connects the signal between layers. The produce PCBs are similar.Each current line is independent.However laser cannot accurately hit the copper pad, contraction level is unstable after the lithography and lamination process. Laser hole will deviate from the copper pad and penetrate the dielectric layer.Then laser defective alignment, will cause a short circuit. How to overcome defective alignment in each process is currently an important take of the printed circuit board industry. Thus, this paper identify critical factor between lamination and laser in Registration Hole, Prepreg, lamination, to alignment of laser drilling.Thus, researchmethod applies the design of experiments to analysis of three factors identify the best combination of process parameters.Then, the optimal parameter is verifiedby lowering the degree of defectivealignment.
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