The Productive Force Analysis on Communication Board in Printed Circuit Board Industry
碩士 === 長庚大學 === 商管專業學院碩士學位學程在職專班經營管理組 === 104 === The purpose of this research is to investigate operational performance of manufactories in Taiwan that produce HDI (High Density Interconnection) of PCBs (Printed Circuit Board). This study applies standard DEA (Data Envelopment Analysis) model as me...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r7p26n |
| Summary: | 碩士 === 長庚大學 === 商管專業學院碩士學位學程在職專班經營管理組 === 104 === The purpose of this research is to investigate operational performance of manufactories in Taiwan that produce HDI (High Density Interconnection) of PCBs (Printed Circuit Board). This study applies standard DEA (Data Envelopment Analysis) model as methodology to do the analysis. The study collects annual data for consecutively 3 years from 2012 to 2014. Companies included in this study were narrowed down from 21 to 16 which decided by their HDI segment accounting for over 60% in revenue.
The results of the study indicated that HDI of PCB companies with technical efficiency of 0.96 in a three-year average are close to Robustly Efficient Units. According to the result, while only minor adjustments are required for reach optimal performance, management and control implemented for various efficiency are still required to improve overall competitiveness of HDI of PCB manufacturers in Taiwan.
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