Evaluation of Thermal Deformation and Strength of Silicon Interposer Used in 2.5D IC Package
碩士 === 長庚大學 === 機械工程學系 === 104 === With the advances of the electronic packaging, 2.5D IC and 3D IC with Cu through silicon vias (copper TSVs) which can providing the improvement of circuit density and interconnect performance become a trend. In every 2.5D IC, there is a Cu TSVs interposer for conne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36dvh8 |