Flatness Investigation of the Embedded Interposer of 3D-ICs
碩士 === 中原大學 === 機械工程研究所 === 104 === With the advancements in technology, electronics products are continuously being miniaturized, low weight and multi-functions in recent years. Generally, lithography procedures are used in the semiconductor industry to achieve the desired miniaturization but are b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62359888954801698586 |