Investigations of Interfacial Reactions in Electronic Materials during Modularization Process
博士 === 國立中興大學 === 化學工程學系所 === 104 === There are two parts in this thesis. The first part is an investigation of peeling test and interfacial reaction of the driver IC in liquid-crystal display. The Sn-coated Cu lead was bonded with Au bump using inner lead bonding technique with different bonding pa...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/80445431078766758187 |