Investigations of Interfacial Reactions in Electronic Materials during Modularization Process
博士 === 國立中興大學 === 化學工程學系所 === 104 === There are two parts in this thesis. The first part is an investigation of peeling test and interfacial reaction of the driver IC in liquid-crystal display. The Sn-coated Cu lead was bonded with Au bump using inner lead bonding technique with different bonding pa...
Main Authors: | Chih-Fan Lin, 林芝帆 |
---|---|
Other Authors: | Chih-Ming Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2016
|
Online Access: | http://ndltd.ncl.edu.tw/handle/80445431078766758187 |
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