Improvising the Rinse Efficiency in a Wafer Rinse Process Using 3D Numerical Modeling and Flow Visualization Methods

• Main Authors: Yen-HengLiu, 劉彥亨
• Other Authors: Chia-Yuan Chen
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/25786882112349552898

碩士 === 國立成功大學 === 機械工程學系 === 104 === Semiconductor wafers, which is the base of any semiconductor devices subjects to numerous bathing in a wafer rinsing tank post each processing operation, in order to remove surface contamination that arises during the manufacturing protocols. However in this method, some of the processing fluid accumulates near the lifters on which the wafers are usually mounted. In this thesis, it was aimed to enhance the wafer rinsing efficiency through the flow field manipulation by implementing a new design of lifters’ through the orientation change of lifting angle. Flow field inside the tank was studied through 3-D numerical modeling and PIV methods mean while changing the orientation of the lifters inside the rinsing tank. From the obtained results, it can be concluded that a better flow field can be derived which will be able to flush out most of the particulates when the orientation of the middle lifter is changed either in a clock or counter clock wise direction at an angle of 600.