APA (7th ed.) Citation

Lee, C., 李志宗, & Leu, J. (2016). Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier.

Chicago Style (17th ed.) Citation

Lee, Chih-Tsung, 李志宗, and Jih-Perng Leu. Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability Between Polyimide Substrate and Glass Carrier. 2016.

MLA (8th ed.) Citation

Lee, Chih-Tsung, et al. Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability Between Polyimide Substrate and Glass Carrier. 2016.