Capacitive Coupling Techniques for Chip-to-Chip Communication
碩士 === 國立東華大學 === 電機工程學系 === 104 === This thesis investigates the chip-to-chip communication in three-dimensional integrated circuits by using dielectric or conductive material as the transport layer. The Raphael build three-dimensional parasitic model and Hspice simulate circuits. Moreover, the des...
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| Format: | Others |
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2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2nkj76 |