Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process
碩士 === 國立高雄第一科技大學 === 電腦與通訊工程研究所 === 104
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| Language: | zh-TW |
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2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49657323589549430470 |
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ndltd-TW-104NKIT5650007 |
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ndltd-TW-104NKIT56500072016-06-20T04:16:31Z http://ndltd.ncl.edu.tw/handle/49657323589549430470 Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process 免水洗式助銲劑對覆晶黏晶封裝製程可靠度分析 Yi-dao Wang 王義道 碩士 國立高雄第一科技大學 電腦與通訊工程研究所 104 Miin-Jong Hao 郝敏忠 2016 學位論文 ; thesis 54 zh-TW |
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NDLTD |
| language |
zh-TW |
| format |
Others
|
| sources |
NDLTD |
| description |
碩士 === 國立高雄第一科技大學 === 電腦與通訊工程研究所 === 104 |
| author2 |
Miin-Jong Hao |
| author_facet |
Miin-Jong Hao Yi-dao Wang 王義道 |
| author |
Yi-dao Wang 王義道 |
| spellingShingle |
Yi-dao Wang 王義道 Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| author_sort |
Yi-dao Wang |
| title |
Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| title_short |
Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| title_full |
Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| title_fullStr |
Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| title_full_unstemmed |
Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process |
| title_sort |
reliability analysis of non-clean flux to flip chip bond process |
| publishDate |
2016 |
| url |
http://ndltd.ncl.edu.tw/handle/49657323589549430470 |
| work_keys_str_mv |
AT yidaowang reliabilityanalysisofnoncleanfluxtoflipchipbondprocess AT wángyìdào reliabilityanalysisofnoncleanfluxtoflipchipbondprocess AT yidaowang miǎnshuǐxǐshìzhùhànjìduìfùjīngniánjīngfēngzhuāngzhìchéngkěkàodùfēnxī AT wángyìdào miǎnshuǐxǐshìzhùhànjìduìfùjīngniánjīngfēngzhuāngzhìchéngkěkàodùfēnxī |
| _version_ |
1718311943562854400 |