Fine Pitch COF 製程之最佳化參數設計

• Main Authors: Ming-Wei Chiang, 江名偉
• Other Authors: Jian-Long Kuo
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/38647622777740863292

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 104 === Because the module steps towards the goals of the low-cost, the high production, and the high resolution, the productive materials have also changed. The original Chip-Of-Film Lead 30um(Fine Pitch COF) changed into 15-22um would make the process index unsteady because of overcoming the variable materials. Furthermore, there is some unsteady pressing engagement shift phenomenon happening in the future, the production of Fine Pitch COF’s the relative process capability needs to be promoted. Then we can raise the high quality production steadily. The main focus of this dissertation in this study Fine Pitch COF by this pressingengagement pressure stability after offset, however, by the use of the method for the first use of Taguchi method in the development of process parameters, and then use response surface methodology for optimal parameters discussion of the interval to meet the optimal parameter combination of multiple quality characteristics. By the above two methods, sorting out the best combination of parameters Fine Pitch COF in the X-axis and Y-axis offset, and test out the result by the amount of actual production, through statistical process control (Statistical Process Control, SPC) to verify its optimal modular parameter can improve stability Fine Pitch COF