| Summary: | 碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 104 === As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device is important for communication through optical fiber networks. The temperature of the device affects its lifetime, the quality of communication and the coupling efficiency of the optical fiber.
Since some of the components of the Optical Fiber Transceiver Device can be made of various materials, this work constructs a three–dimensional Optical Fiber Transceiver Device model using the ANSYS 15.0/Fluent software for implementing the finite volume method, and to investigate the effects of the thermal conductivity coefficient of the materials on heat dissipation by the device.
Among five components which have alternative materials — substrate, housing, coating, SMT substrate and solder ball –– the results revealed the dissipation of heat by the device was dominated by the variations of substrate and SMT substrate’s thermal conductivity coefficient. These critical variables were fitted using equations in terms of the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling. The effect of the laser power on the fitting model was considered. Then, the design rule corresponding to the critical components’ thermal conductivity coefficient of the Optical Fiber Transceiver Device was obtained successfully. The errors between the simulated and the fitted results which were concluding the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling were less than 9%. At a heat dissipation by the laser of 210mW, when the thermal conductivity coefficients of the substrate and the SMT substrate’s material were 2W/m℃ and 60W/m℃, the maximum temperature of the device and the difference between the inlet and outlet temperatures were less than 85℃ and 12℃, respectively.
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