Theoretical Studies of the Dicing Forces and Temperature Distribution on Wafer Dicing Process

• Main Authors: Bo-Wen Zheng, 鄭博文
• Other Authors: Yuang-Cherng Chiou
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/46963803527343486775

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 104 === In this study, a heat transfer model is established based on the finite difference method to solve heat transfer problems and to predict the temperature distribution of workpiece during the wafer dicing process. Effects of workpiece size, feed rate, blade speed, and boundary conditions on the temperature distribution of the workpiece are investigated. Based on the workpiece as the semi-infinite body, the classical solutions for the heat transfer analysis of this process can be obtained, but the error between the predicted temperature and numerical one increases with decreasing thickness of the wafer. Numerical results show that for a constant feed rate, the temperature of the workpiece decreases with increasing thickness of the workpiece. The material at the trailing edge of workpiece remains high temperature for the thickness less than 2 mm when the heat source moves away. The use of the cutting fluid helps to reduce the temperature. For a constant heat flux, the temperature decreases with increasing feed rate with a smaller area of high temperature. From the empirical formula of the experiments, the dicing force increases along with the feed rate. Hence, the heat source increases along with the feed rate, so that the temperature increases. However, the blade speed has the opposite effect. Consequently, the feed rate is the dominant parameter on the wafer dicing process.