The Study of Highly Adhesive Electroless Nickel Plating Film on Silicon Wafer
碩士 === 國立清華大學 === 化學工程學系 === 104 === Electroless deposition of nickel-phosphorus (Ni-P) film is a promising skill for the preparation of diffusing barrier layer in silicon and circuit board industry. Typically, Sn/Pd colloid is the most common catalyst for electroless deposition. However, lacking of...
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| Format: | Others |
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2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pv8mj3 |