The Study of Highly Adhesive Electroless Nickel Plating Film on Silicon Wafer
碩士 === 國立清華大學 === 化學工程學系 === 104 === Electroless deposition of nickel-phosphorus (Ni-P) film is a promising skill for the preparation of diffusing barrier layer in silicon and circuit board industry. Typically, Sn/Pd colloid is the most common catalyst for electroless deposition. However, lacking of...
Main Authors: | Hsu, Chin Wei, 許晉偉 |
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Other Authors: | Wei, Tzu-Chien |
Format: | Others |
Published: |
2016
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Online Access: | http://ndltd.ncl.edu.tw/handle/pv8mj3 |
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