Free surface of a mold flow in mold-filling process

• Main Authors: Lee, Syu-Dong, 李旭東
• Other Authors: Lee, Shong-Leih
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/40636783021440664751

碩士 === 國立清華大學 === 動力機械工程學系 === 104 === To study the change of free surface profile in mold-filling process, we simulating a Horizontal flow field. To ensure the required dynamic contact angle, the liquid meniscus near the wall region is corrected by natural cubic spline and thus successfully removes the stress singularity. We refer to the characteristic of the pressure distribution on free surface postulated by Lee and Liao and suppose a pressure distribution equation on free surface. Using the Runge-Kutta method of order four, the free surface profile corresponding to pressure distribution equation is found. We can correct the parameters of pressure distribution equation to make the corresponding free surface profile fitting the flow field’s free surface profile and if the free surface profile coincided, the pressure distribution is the correct value. Simultaneously, we can observe the change of free surface profile with different parameters of pressure distribution equation.