The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer
碩士 === 國立清華大學 === 工程與系統科學系 === 104 === 因申請專利緣故，資料延後公開
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| Format: | Others |
| Language: | en_US |
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2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02282869037614424784 |
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ndltd-TW-104NTHU5593077 |
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oai_dc |
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ndltd-TW-104NTHU55930772017-07-16T04:29:26Z http://ndltd.ncl.edu.tw/handle/02282869037614424784 The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer 藉由Ag3Sn介層有效抑制無鉛焊錫中熱遷移所導致的銅原子流量之研究 Lin, Yu Fang 林玉芳 碩士 國立清華大學 工程與系統科學系 104 因申請專利緣故，資料延後公開 Ouyang, Fan Yi 歐陽汎怡 2016 學位論文 ; thesis 95 en_US |
| collection |
NDLTD |
| language |
en_US |
| format |
Others
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| sources |
NDLTD |
| description |
碩士 === 國立清華大學 === 工程與系統科學系 === 104 === 因申請專利緣故，資料延後公開
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| author2 |
Ouyang, Fan Yi |
| author_facet |
Ouyang, Fan Yi Lin, Yu Fang 林玉芳 |
| author |
Lin, Yu Fang 林玉芳 |
| spellingShingle |
Lin, Yu Fang 林玉芳 The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| author_sort |
Lin, Yu Fang |
| title |
The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| title_short |
The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| title_full |
The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| title_fullStr |
The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| title_full_unstemmed |
The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer |
| title_sort |
effective suppression of thermomigration-induced cu flux in lead free solder joints by ag3sn interlayer |
| publishDate |
2016 |
| url |
http://ndltd.ncl.edu.tw/handle/02282869037614424784 |
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