| Summary: | 碩士 === 國立臺灣海洋大學 === 輪機工程學系 === 104 === There are lots of contacts with Sulfur Ion on the manufacturing of Printed circuit board, such as the process of Display bonding with Anisotropic Conductive Film (ACF). Thus the material selection of ACF is essential.
The market is flooded with many types and special material for ACF. But due to the copper powder left from Printed circuit board punching, with current passing when display is on, it will lead to short problem overtime as copper ion will migrate. The correct selection of ACF could help avoid such problems.
We conducted mapping with SEM-EDS and found the copper and S reacted overtime and started to drift away. We have also done Migration Test of Trace with samples. It did not short, but the appearance of trace is discolored obviously, which is caused by copper ion migration. And it is potentially dangerous, especially products requested high reliability. We have to pay more attention to such products.
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