A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure

碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 104 === This study will be used polymethyl methacrylate (acrylic) as the substrate, by plasma enhanced chemical vapor deposition system (PECVD), thermal evaporation system, RF magnetron co-sputtering system, and spray painting, testing and adhesion improvement...

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Main Authors: Jian-Zhi Chen, 陳建智
Other Authors: Day-Shan Liu
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/y7g57r
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spelling ndltd-TW-104NYPI51240362019-09-22T03:41:18Z http://ndltd.ncl.edu.tw/handle/y7g57r A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure 利用緩衝層結構改善薄膜沉積於壓克力基板附著度之研究 Jian-Zhi Chen 陳建智 碩士 國立虎尾科技大學 光電工程系光電與材料科技碩士班 104 This study will be used polymethyl methacrylate (acrylic) as the substrate, by plasma enhanced chemical vapor deposition system (PECVD), thermal evaporation system, RF magnetron co-sputtering system, and spray painting, testing and adhesion improvement on a functional thin film that include hard coatings thin film, reflection thin film, anti-Glare Coating and transparent conductive thin film. The results showed that when the functional thin film adhered to the acrylic substrate only 0B degree level, in order to improve the adhesion of the functional thin film on the acrylic substrate using PECVD deposition of the organic silicon thin film as a buffer layer for the purpose of enhancing the adhesion of the functional thin film between the acrylic substrate and to reduce the residual stress after the thin film deposition, the degree of adhesion level reaches 5B, then through the force of 100 mN flannel friction 1000 times, hydrochloric acid and brine environmental testing to explore the functional thin film for improving results under harsh environment stability. In order to analyze the reasons of the improvement on the thin film, and using a surface profiler measurement of curvature before and after the thin film deposition, and then calculate for residual stress via Stoney equation, when the residual stress is smaller the better adhesion of the thin film.Using Fourier transform infrared spectroscopy measure thin film chemical bonding, and analyze attachment relationship with the homogeneity of material.X-ray diffraction measure the crystallinity of the thin film, the thin film is attached to the analysis of the crystalline degree of influence.Measuring the contact angle that the thin film surface hydrophilic and hydrophobic, hydrophilic and hydrophobic for analysis of the impact on attachment.Measured using an atomic force microscope roughness of the thin film, analyze the relationship between roughness and adhesion. Day-Shan Liu 劉代山 2016 學位論文 ; thesis 82 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 104 === This study will be used polymethyl methacrylate (acrylic) as the substrate, by plasma enhanced chemical vapor deposition system (PECVD), thermal evaporation system, RF magnetron co-sputtering system, and spray painting, testing and adhesion improvement on a functional thin film that include hard coatings thin film, reflection thin film, anti-Glare Coating and transparent conductive thin film. The results showed that when the functional thin film adhered to the acrylic substrate only 0B degree level, in order to improve the adhesion of the functional thin film on the acrylic substrate using PECVD deposition of the organic silicon thin film as a buffer layer for the purpose of enhancing the adhesion of the functional thin film between the acrylic substrate and to reduce the residual stress after the thin film deposition, the degree of adhesion level reaches 5B, then through the force of 100 mN flannel friction 1000 times, hydrochloric acid and brine environmental testing to explore the functional thin film for improving results under harsh environment stability. In order to analyze the reasons of the improvement on the thin film, and using a surface profiler measurement of curvature before and after the thin film deposition, and then calculate for residual stress via Stoney equation, when the residual stress is smaller the better adhesion of the thin film.Using Fourier transform infrared spectroscopy measure thin film chemical bonding, and analyze attachment relationship with the homogeneity of material.X-ray diffraction measure the crystallinity of the thin film, the thin film is attached to the analysis of the crystalline degree of influence.Measuring the contact angle that the thin film surface hydrophilic and hydrophobic, hydrophilic and hydrophobic for analysis of the impact on attachment.Measured using an atomic force microscope roughness of the thin film, analyze the relationship between roughness and adhesion.
author2 Day-Shan Liu
author_facet Day-Shan Liu
Jian-Zhi Chen
陳建智
author Jian-Zhi Chen
陳建智
spellingShingle Jian-Zhi Chen
陳建智
A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
author_sort Jian-Zhi Chen
title A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
title_short A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
title_full A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
title_fullStr A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
title_full_unstemmed A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure
title_sort study of the adhesion improvement on a thin film deposited on the pmma substrate using buffer-layered structure
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/y7g57r
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