Study on the Structure Characteristics and Applications of hBN/epoxy Composite

• Main Authors: Chien-Ting Wu, 吳鑑庭
• Other Authors: 蘇程裕
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/26g6hc

碩士 === 國立臺北科技大學 === 製造科技研究所 === 104 === This study takes advantage of surface activation and modification of powders processed separately investigate the influence of different modification techniques hBN modified and add a variety of formulations for the powder , and the influence of multiple particle size and material in powder solid content (40 ~ 70wt%) of the microstructure of the composite arrangement , dielectric properties , thermal conductivity and thermal expansion characteristics are analyzed and discussed. The study found that the use of silane modified boron nitride powders can be improved boron nitride powder in the epoxy resin dispersion conditions and promote constitute the thermal conductivity of the network , effectively improve the thermal conductivity of the composite material, from FTIR the result of that hBN modified before pickling / caustic can be made of the removal of the original functional groups , and with methanol , ethanol and other organic alcohols substitution reactions able to meet the functional groups , the surface modification of the object structure, and the ring oxygen affinity resin has significantly improved through the acid / caustic modified and grafted functional groups of the boron nitride composite thermal conductivity at 70wt% up to 5.3W / m‧K. Through further enhance the filling more complex and large single crystals of boron nitride single crystal of alumina filling efficiency , thereby enhancing the heat conduction properties, the thermal conductivity at 70wt% up to 5.8W / m‧K.In thermal expansion , the dominant factor is the surface area and volume content , for the SS, AB31, N31, BN06 four different sets of filling material , the most effective suppression of thermal expansion is 70wt% N31 in the thermal expansion coefficient of 81.96 × 10^-6. Compatibility between the organic inorganic material greatly affect the dielectric properties , SS and N31 measurement results were 21.6 kV/mm and 21.36 kV/mm; and its control group , BN06 dielectric strength of up to up to 32.86 kV/mm; and the dielectric strength of AB31 was 26.67 kV/mm. From the micro- structure was observed due to the poor so that the contact interface between the interior material inclusions many pores, resulting in deterioration of the dielectric strength fill rate increase, the powder compact stacking arrangement between the dielectric properties also has gain.