Fabrication of micro copper pillar structured arrays by using photo-assisted electrochemical etching technique and supercritical electroplating process
碩士 === 國立臺北科技大學 === 機電整合研究所 === 104 === In this study the photo-assisted electrochemical etching (PAECE) was used for the fabrication of high aspect ratio hole array, formed into through silicon via (TSV) by mechanical polishing, and were filled by supercritical electroplating technique, to prove th...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Online Access: | http://ndltd.ncl.edu.tw/handle/6jsth5 |