| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系 === 104 === Electronic products tend to become high performance, high speed and high density packaging. Thus, the development of metallic wire with high reliability and good bonding properties for electronic packaging becomes very urgent and important issue. Recently there are some arduous problems by using of gold, copper and silver bonding wires, such as poor of strength, conductivity and corrosion resistance and intermetallic brittleness. In numerous applications of modification of alloys with rare earth elements appeared miraculous effects. Also in some instances have demonstrated that rare earth elements can quite substantially improve the physical and mechanical properties of alloys. In order to improve mechanical properties of silver bonding wire for electronic packaging, various amounts of rare earth elements are selected as alloying additions into silver in the study. The influence of the addition of rare earth elements on electrical and chemical reaction properties of silver has been investigated. The effects of light rare earth element (LREE) La and heavy rare earth element (HREE) Y with different solubility in silver on the microstructures and mechanical properties have been discussed in the study. The influence of rare earth element amount on grain refinement, strength, hardness, high temperature oxidation, corrosion and electrical properties has been also evaluated.
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