The Market Analysis and Future Development of Fan-Out Wafer Level Packaging (FOWLP) in Advanced Packaging Technology

• Main Authors: Huang, Shih-Feng, 黃世豐
• Other Authors: Chiu, Jian-Jung
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/rf7484

碩士 === 輔仁大學 === 科技管理學程碩士在職專班 === 105 === Semiconductor Industry has been developed in Taiwan for more than 40 years. It’s one of the major industries which makes Taiwan the second-largest semiconductor supplier in the world. Moreover, Taiwan IC packaging industry takes more than 50% market share all over the world. In 2016, TSMC launched the integrated Fan-Out process that break through the bottleneck in Moore’s Law and make the foundries moving into IC packaging field. The advantages of new fan-out technology are made by non-substrate process with smaller package. For smartphone applications, fan-out process is a better technology to replace flip-chip package. Thus, fan-out technology will impact the overall development of semiconductor industry. In this study, the development of fan-out wafer level package will be investigated. The research papers and marketing reports are collected to analyze to dig out the future market opportunity. The experts of IC packaging factory and sub-suppliers were also interviewed to illustrate the current marketing environment and future opportunities of fan-out process in the IC packaging industry in Taiwan.