TSV Characterization and Modeling
碩士 === 義守大學 === 電機工程學系 === 105
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2017
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ndltd-TW-105ISU054420162019-05-15T23:39:36Z http://ndltd.ncl.edu.tw/handle/75xrxu TSV Characterization and Modeling 三維積體電路之直通矽晶穿孔(TSV)特性分析 Yan-Bo Lin 林彥伯 碩士 義守大學 電機工程學系 105 Tsung-Lung Pan 潘宗龍 2017 學位論文 ; thesis 114 zh-TW |
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NDLTD |
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zh-TW |
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Others
|
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碩士 === 義守大學 === 電機工程學系 === 105 |
author2 |
Tsung-Lung Pan |
author_facet |
Tsung-Lung Pan Yan-Bo Lin 林彥伯 |
author |
Yan-Bo Lin 林彥伯 |
spellingShingle |
Yan-Bo Lin 林彥伯 TSV Characterization and Modeling |
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Yan-Bo Lin |
title |
TSV Characterization and Modeling |
title_short |
TSV Characterization and Modeling |
title_full |
TSV Characterization and Modeling |
title_fullStr |
TSV Characterization and Modeling |
title_full_unstemmed |
TSV Characterization and Modeling |
title_sort |
tsv characterization and modeling |
publishDate |
2017 |
url |
http://ndltd.ncl.edu.tw/handle/75xrxu |
work_keys_str_mv |
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1719150825272508416 |