Sn/Ag Colloids as Activators for Electroless Copper Deposition on Printed Circuit Boards

• Main Authors: Cheng-Hsien Li, 李正賢
• Other Authors: Chien-Liang Lee
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/uk2225

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 105 === The Sn/Ag colloids were prepared using various tin salts, including tin(II) pyrophosphate, tin(II) oxalate, and tin(II) sulfate, and applied as activators for the electroless copper deposition (ECD) in printed circuit board. In the study, the side walls of the holes in the FR-4 substrate, fabricated from epoxy mixed with glass fibers, were immersed in commercial clean and condition bath and then treated by microetching step prior to the ECDs. The results showed the high potential and low cost of the Sn/Ag colloids as activators in a commercial ECD process.