Computer Vision Based Defect Detection of Die Bonding in IC Package Process
碩士 === 國立中興大學 === 資訊管理學系所 === 105 === There are some inspection stages in integrated circuit packaging process for meeting the quality standards and keeping the quality stable. We need so many persons using a microscope to check whether the quality defects exist or not after wire bonding (3RD inspec...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60353342686900804699 |