Development of micro-porous ceramic grinding ingot

碩士 === 國立勤益科技大學 === 機械工程系 === 105 === LED chip is currently the mainstream of single crystal alpha alumina, as for the grinding processing efficiency of single crystal α alumina is concern as a big research trend. Generally, the industry uses grinding wheel with the grit size of hundreds has increas...

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Bibliographic Details
Main Authors: Fong - Jing Lin, 林風經
Other Authors: Ming-Yi Tsai
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/m9938p
Description
Summary:碩士 === 國立勤益科技大學 === 機械工程系 === 105 === LED chip is currently the mainstream of single crystal alpha alumina, as for the grinding processing efficiency of single crystal α alumina is concern as a big research trend. Generally, the industry uses grinding wheel with the grit size of hundreds has increase to the grit size of thousands to carry out grinding, lapping process and chemical mechanical polishing for the last process. During the grinding process to lapping process, the grinding wheels has to be change all time, this lead to high supplies, long processing time. Therefore, both grinding and lapping process is desired to shortened to a single process. In this study, micro-porous ceramic grinding apparatus was developed to remove hard and brittle materials with the principle of grinding wheel grinding and mechanical polishing. In this study, the development of micro-porous ceramic grinding device is divided three parts: 1, Using optimal sintering process to manufacture micro-porous with the diameter of 50μm of the ceramic ingots. 2, Preparation of diamond concentration of 75 and 100 micro-porous ceramic grinding ingots to carry out grinding process under different pressure and rotational speed; The experimental results show that the concentration of 75,100 ceramic grinding ingot surface susceptible to pressure and rotational speed leaving the microstructure of the ceramic ingots to produce self-sharpening effect, resulting in the enhancement of the material removal rate. 3, Preparation of round or arc ingot of micro-porous ceramic grinding disc, the experimental results show that the material removal rate of 75 arc ingot plate is 0.90-1μm / min and surface roughness is 15-25nm; Arc grinding plate that produce by manufacturers has a material removal rate of 0.9-1μm / min and surface roughness is 20-30nm. In this research, the development of micro-porous ceramic grinding plate, from the choice of ceramic materials, sintering characteristics, ceramic grinding disc production, processing parameters, grinding discs of different types of changes and hole grinding disc dressing quality, different types of grinding plate and micro-porous ceramic grinding plate dressing quality, hoping its development and research for the industry and academia in the single crystal α alumina hard and brittle material processing benefits contribute.