Study of the Optimum Parameters of Finger Print Sensor IC in Wire Bonding for BGA Device

• Main Authors: Yao,Shih-Che, 姚仕哲
• Other Authors: WANG,CHAO-SING
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/46fhgw

碩士 === 國立彰化師範大學 === 電機工程學系 === 105 === Finger Print Sensor (FPS) products have been applying popularly. Many consumer electronics manufacturers have been going into the operation of FPS. There are plenty of companies have integrated FPS products. However, the production capacity of BGA assemble house is often limited, but for the BGA assemble house also has challenge. The bottleneck of assembly process is always at the wire bond process, especially at the capacity and quality issues. The order of the customers depends on the capacity of the wire bond process. In order to meet customer’s target, to strengthen the capacity and improve quality for all wire bonder is the first priority. In order to strengthen quality at wire bond production, assembly house is phasing in the latest equipment. In this thesis, we discuss how to design the wire bond processing parameters and investigate the wire bond machine parameters for finger print sensor product by using the response surface methodology. The application of response surface methodology. Both will be used to determine the bonding quality by wire-pill testing, ball-shear testing, and IMC (Inter Metal Coverage).