Electroless Copper Deposition on Silane Modified IC Substrate
碩士 === 國立清華大學 === 化學工程學系所 === 105 === Traditional electroless copper deposition technology cannot satisfy the requirement of fine linewidth and minimal signal loss, which are the features of advanced circuitry. To meet the feature of fine linewidth and minimal signal loss of advanced circuit, modern...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/q5txsc |