The Study of FC BGA Board Level Performance Improvement

• Main Authors: Cho-Yu Huang, 黃琢瑜
• Other Authors: Ming Chang Shih
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/srgx5q

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === In this paper, the failure rate of BLRT (Board Level Reliability Test) is discussed and analyzed. In the analysis, we need to analyze the possible influence of different parameters of substrate, underfill, and solder ball materials. Shadow Moiré was used to observe the warpage caused by the difference between the substrate and the results of numerical simulation. Analyze the failure modes of different sizes and constituent solder balls by ball shear test. It was found that the size of the underfill material had little effect on the substrate coplanarity, and the size of the solder ball would have different effects on the impact and bending test, and the ability to enhance the impact and bending test by adding different micro-alloying elements. Of the relevant solder ball size and composition optimization parameters are also proven by the process of yield control.