The Investigation of Reliability Check for Palladium Copper Wire and Copper Wire
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === With the high price of gold, gold-based packaging costs continue to increase, many packaging manufacturers in order to reduce costs have developed new wire materials to rEPMAce the gold line, and strive to not affect the performance of products...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a9jjfm |