The Investigation of Reliability Check for Palladium Copper Wire and Copper Wire
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === With the high price of gold, gold-based packaging costs continue to increase, many packaging manufacturers in order to reduce costs have developed new wire materials to rEPMAce the gold line, and strive to not affect the performance of products...
Main Authors: | Tzu-Hung Tseng, 曾子航 |
---|---|
Other Authors: | Wen-Kuan Yeh |
Format: | Others |
Language: | zh-TW |
Published: |
2017
|
Online Access: | http://ndltd.ncl.edu.tw/handle/a9jjfm |
Similar Items
-
The Study for Reliability of Wire-bonding Process by Copper Wire
by: Chong-Wei Hung, et al.
Published: (2014) -
Effect of Palladium Distribution on High Temperature Storage Reliability of Palladium Coated Copper Wire
by: Lai, Po-Ying, et al.
Published: (2018) -
The Investigation of Relationship between Wire Bonding Process Parameter and Reliability of Copper Wire
by: YANG, CHU-WEN, et al.
Published: (2017) -
The Study of Liability of Palladium Coated Copper Wire Bonding due to the Distribution of Palladium
by: LEE,YU-CHIN, et al.
Published: (2017) -
Bondability Analysis and Reliability Design on Copper Wire Bonding
by: Hung-Sheng Jang, et al.
Published: (2010)