The Study of Intelligent Manufacturing of the Printed Circuit Board Equipment

• Main Authors: Lai,Ching Wen, 賴慶文
• Other Authors: Chui-Yu Chiu
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/cpy65u

碩士 === 國立臺北科技大學 === 工業工程與管理系EMBA班 === 105 === In the PCB industry, information has always been stored in the device or by the engineering staff to manually collect, the data may be due to equipment system failure or lack of storage capacity of equipment is deleted or overwritten. When the device is abnormal, to find historical records or do statistical analysis, often appears to lack of data integrity, and the need to take the initiative to collect one by one, time-consuming and laborious. Moreover, the equipment at the same time, managers may take tens of minutes to receive the news of the return, resulting in equipment utilization rate and product yield has been unable to further improve. The topic of industry 4.0 continues to be discussed, PCB industry began to attach importance to data collection and analysis, so through the Internet of Things technology, the equipment will be sent to the cloud for storage of data is an inevitable trend. Information that is automatically uploaded to the cloud from the device gives users a comprehensive view of the production of all their devices. Engineers can quickly analyze problems with the information in the cloud database. Cloud database backup system, so that data can be permanently saved. Therefore, the equipment intelligent service platform designed by the Institute is to provide the information of the equipment to the cloud, to provide manufacturers and customers with better control of the production results, to reduce the gap of equipment stagnation, and to optimize the production schedule.