| Summary: | 碩士 === 國立臺北科技大學 === 化學工程研究所 === 105 === The purpose of this study was to investigate the mechanical properties, thermal properties, water absorption of an epoxy resin and epoxy/clay nanocomposites. An emulsifier-free emulsion polymerization (EFEP) is used to prepare epoxy resin and nanocomposites. The experiment project is divided into three sequential stage: clay, epoxy resin, nanocomposites. To begin with, the clay was modified via cation exchange with ammonium salts of poly(propylene glycol) bis-2 aminopropyl ether (400 and 2000 Mw).Then, the epoxy resin was cured with liquid anhydride (4-Methylcychexane-1, 2-dicarboxylic Anhydride, MHHPA) and catalyst (1-Methylimidazole). Finally, the nanocomposites prepared by the (EFEP) method involve dispersing the clay in solution with vigorous stirring, causing the clay layers to separate. The epoxy monomer was added to the clay-solution and mixed for a period of time, resulting in a uniform dispersion of the clay layer inside the
epoxy.
In the SEM and XRD analysis, we found the presence of the silicate platelets in
the epoxy substantially enhances the glass transition temperature 12℃ and 37℃ by loading
0.2wt%-D400 and 0.2wt%-D2000 of the intercalated platelets. In addition, the coefficient of thermal expansion (CTE) decrease 20% and 34% respectively. At the same time, we have found that the water absorption and internal stress properties of the nanocomposites are dependent on the clay layer inside the epoxy.
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