The Study of Improving Warpage of Flash Driver Cap by CAE Analysis
碩士 === 國立臺北科技大學 === 製造科技研究所 === 105 === Warpage deformation of a flash driver cap may occur after injection molding. If the warpage is too large, the cap will not be able to assemble with outer casing. This study is to investigate the bore warpage deformation of flash driver cap using Moldex3D R12 s...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/n5g3cw |