| Summary: | 碩士 === 國立雲林科技大學 === 化學工程與材料工程系 === 105 === In this study, mainly studied the epoxy matrix and conductive microspheres required for the Anisotropic Conductive Film(ACF). Preparation of Microspheres Polymerization is used Dispersion Polymerization. This Polymerization use methyl methacrylate(MMA) as monomer, Azobisisobutyronitrile(AIBN) as initiator Polyvinylpyrrolidone(PVP) as stabilizer and different ratio of silane coupling agent(TSPM) to produce the surface functional copolymerized polymer particles that has monodispersity. The homogeneous PMMA microspheres were prepared under the condition of changing monomer concentration, reaction temperature and solvent. After that, the electroless plating nickel on the silanol group(Si-OH) can generate covalent bonding (Si-O-Ni),which silanol group was obtained from the hydrolysis and condensation of silane coupling agent's alkoxysilane group(Si-O-CH3). The Ni-Au metal bonding conductive plating polymer particles can be made by the electroless gold plating. The Epoxy resin has been used as insulation adhesive with Jeffamine, Imidazole and conductive particle. Mixing up those materials, and apply it to released-papper. Finally, the Anisotropic Conductive Film can be made.
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