The Improvement of Galvanic Effect on Selective Gold Plating Product
碩士 === 元智大學 === 化學工程與材料科學學系 === 105 === In this study, we use IC carrier that surface treat with selective gold plating and OSP then react with ammonium hydroxide dipping treatment, to make ammonium hydroxide react with copper adhere on gold surface of substrate. It can effectively improve Galvanic...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5b7v4h |
| Summary: | 碩士 === 元智大學 === 化學工程與材料科學學系 === 105 === In this study, we use IC carrier that surface treat with selective gold plating and OSP then react with ammonium hydroxide dipping treatment, to make ammonium hydroxide react with copper adhere on gold surface of substrate. It can effectively improve Galvanic corrosion due to Galvanic effect and no side effects of ammonium hydroxide dipping treatment on substrate surface characteristics include both morphology and roughness. It promotes the quality in this process of IC substrate manufacturing. In this study, we use DOE (Design of Experiment) experiment method to set different ammonium hydroxide concentration and dipping time. According to experimental result, we find ammonium hydroxide dipping treatment (5%-30seconds) is the optimum parameter and find no copper adhere on gold surface.
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