Analysis of the Subjected Stresses of Automotive Electronic Components in Vibration Environment

• Main Authors: Lin-Sen Huang, 黃琳森
• Other Authors: Yeong-Shu Chen
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/mapwuj

碩士 === 元智大學 === 機械工程學系 === 105 === This study explores the stresses of the automotive electronic components in the random vibration environment. It is aimed to predict the time of failure for components so as to extend its life in improving their performance for the driving safety concern. Firstly, the related theory and mechanics when the electronic component was subjected to vibration loads for located on the printed circuit boards are discussed. Then the finite element simulation was conducted with the ANSYS Workbench software. Secondly, the electronic component is soldered to the circuit board and the whole module is installed on the shaker for the vibration test. The corresponding experimental, theoretical and simulated results are examined both for the verification purpose and error comparison. It is found that the printed circuit board with dimensions of 215 (L) x115 (W) x1 (H) mm and is fixed on its two short sides has the natural frequencies of the first three modes 81.50 Hz, 140.25 Hz, and 238.00 Hz, respectively. The measured frequencies are consistent with those of ANSYS simulation results and the errors are less than 5%. Finally, a capacitor and a resistor were soldered to the circuit boards individually, and both of them are placed on the vibration shaker for the random vibration test one after another. By referring to IPC-9701 for electronic components failure criteria and using the Miner's Rule, the calculation of the capacitor’s life is about 109 minutes. However, it was not detected a failure in a 2 hours physical test. Meanwhile, the calculated failure time of the resistor was about 108 minutes while the measured experimental life was 87 minutes, with a 24.1% error.