Analysis and Measurement of Adhesive Properties to Optical System Reliability

碩士 === 健行科技大學 === 電機工程系碩士班 === 106 === This study aims to explore the adhesives that can be applied in the field of optics. The adhesive materials have different characteristics, therefore, the adhesives jointly developed by the commercial or the commissioned manufacturers are selected as the resear...

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Bibliographic Details
Main Authors: Chia-Yu Chang, 張家毓
Other Authors: Wen-Lung Lu
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/mus564
Description
Summary:碩士 === 健行科技大學 === 電機工程系碩士班 === 106 === This study aims to explore the adhesives that can be applied in the field of optics. The adhesive materials have different characteristics, therefore, the adhesives jointly developed by the commercial or the commissioned manufacturers are selected as the research examples of the adhesives for optical component placement. Before the analysis, it is necessary to first analyze the characteristics of the material selected for the adhesive, and then find the reliable adhesive condition by the test. Then find reliable adhesive conditions by testing, use optical components to adhere to the optical system, and testify the reliability of different conditions. Through the measurement of the slight variation of the optical components in the optical system, the difference between the reliability test and the before and after is analyzed, and the offset under different loop measurement parameters is observed to select the reliability of the adhesive to meet the specifications of the optical system design. From the results of the characteristic data analysis of the adhesive, it is known that the effect of the offset of the curing shrinkage and the humidity in the reliability test is the largest, and the control of the curing shrinkage rate and the water absorption rate can improve the reliability of the optical system after assembly. The results of this study can be applied to a variety of assembly processes with precise requirements, such as optical system components, semiconductor wafer placement and optoelectronic components.