Failure Analysis Applied for Automated Testing Platform

• Main Authors: Hsu,Shih-Hsien, 許世賢
• Other Authors: JONG, GWO-JIA
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/858a39

碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === Due to the different system-in-package technology (SiP), the migration and development towards the nanometer generation has made the defects of product failures smaller and more difficult to be discovered and observed. In order to find out the specific cause of failure, corrective measures must be taken to allow the product to smoothly enter the next process. Therefore, how to quickly identify the fundamental cause of failure analysis has already become an important issue. This thesis researches an automated test platform to conduct electrical test of product failure analysis. The platform adopts LabVIEW as the software development environment and then with the relevant equipment of National Instruments (NI) for designing an automated measurement platform. Firstly, we take out 1000 tested and passed products to analyze the data of each pin and then use the standard deviation formula to calculate the benchmark of good and bad products. Secondly, we collect the measurement data of the electrical characteristics for converting into a characteristic graph to determine whether the relevant measured value is normal or abnormal. Finally, the non-destructive or destructive analysis method is used for verification. The verification result is consistent with the experimental results. The automated measurement platform is compared with manual detection. This thesis provides reliable and accurate measurement results in the shortest time. It is not only improves the appearance of the product's pin without being damaged, but also shortens the time required for analysis. The thesis can make failure analysis more efficient and improve product yield and quality.